Manufacturing method

ABSTRACT

The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes. 
     Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically. 
     The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position. 
     The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

This is a continuation application of Ser. No. 772,823, filed Aug. 6,1985 now U.S. Pat. No. 4,674,670.

BACKGROUND OF THE INVENTION

The present invention relates to a manufacturing apparatus, andparticularly to a manufacturing apparatus that is suitably adapted to ageneral-purpose bonder as represented by a wire bonder which is designedfor fabricating a variety of kinds of lead frames fully automaticallyand highly efficiently.

Accompanying the trend toward producing diversifying kinds ofsemiconductor devices such as IC's and LSI's in recent years, it is atendency to utilize a general-purpose semiconductor manufacturingapparatus which is capable of manufacturing a variety of devices insteadof using a special apparatus which manufactures only a single kind ofdevice. For instance, the same tendency holds true even for a pelletbonder for adhering pellets onto lead frames, and for a wire bonder forconnecting very fine wires between the pellet and the lead frame; i.e.,efforts have been made to improve these apparatuses so that they meetgeneral purposes.

Referring, for example, to the wire bonder, the lead frames (hereinafterreferred to as works or workpiece) onto which element pellets arefastened are placed on a bonding stage, the works that are continuouslyformed are incrementally moved by a feeding mechanism called a framefeeder, and bonding positions on the works are successively set to aposition corresponded to a bonding tool, thereby to bond the wires.Here, in order to incrementally feed the works, feed pins on the side ofthe frame feeder are fitted into positioning holes formed in the works,so that the works are moved as a whole by the feed pins. In this case,the frame feeder is constituted depending upon the kind of works, i.e.,depending upon the shape, dimension, and the like of works and,particularly, the feed pins are so constituted as will be adapted to thepositioning holes of works.

Therefore, even though it has been demanded to construct apparatuses tomeet general purposes as described above, there exists difference in theshapes of works, dimensions, positions of holes, and sizes of holesdepending upon the kinds of devices (standards of the lead frames aredifferent among the manufacturers), making it difficult to accomplishcorrect positioning by the frame feeder for the works of differentkinds. With the existing apparatuses of this type, therefore, thebonding stage or the frame feeder are constructed in the form of a unitso as to be exchanged depending upon the kind of devices, to meetgeneral purposes.

With such apparatuses, however, the unit must be exchanged for eachchange in the kind of devices, involving laborious work for replacement,very cumbersome adjusting operation consuming extended periods of time,and making the operation efficiency and the manufacturing efficiencypoor. Moreover, the operator must carry out the manipulation after everychange in the kind of devices, making it impossible to operate theapparatus fully automatically.

The technique of wire bonding has been closely disclosed in "DenshiZairyo", November, 1982, Separate Volume, published by Kogyo Chosakai onNov. 15, 1982, pp. 163-168.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a fully automatedgeneral-purpose bonder which dispenses with the exchange of such aportion as the frame feeder unit for the works of different kinds, whichenables the operation efficiency to be enhanced, and which followsautomatically the change in the kind of devices to effect the bondingmaintaining precision.

The above and other objects as well as novel features of the inventionwill become obvious from the description of the specification and theaccompanying drawings.

A representative example of the invention disclosed in the applicationwill be briefly described below.

Namely, provision is made for moving means to continuously move theworks that are conveyed along the frame chute and detector means todetect at least a portion of the works that are moved, whereby themoving means is controlled relying upon the data related to the kind ofworks and work position signals produced by the detector means, in orderto set the works at predetermined positions. That is, the works are setat optimum bonding positions without the need of exchanging the uniteven for work of different kinds, and the manufacturing operation iscarried out fully automatically satisfying general purposes.

According to the present invention, furthermore, provision is made formeans to move the frame chute in a direction at right angles to thedirection in which the work is moved, in order to effect the positioningand bonding fully automatically even for the works having differentwidths and shapes in the direction of width thereof.

Moreover, the detector means can be provided not only at the bondingposition but at a position on the upstream side which establishes arelation relative to the bonding position.

The invention can be adapted particularly effectively to wire bondersand pellet bonders.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view of a first embodiment of the present invention;

FIG. 2 is a side view;

FIG. 3 is a plan view;

FIG. 4 is a front view showing major portions of a bonding stage;

FIG. 5 is a side view thereof;

FIG. 6 is a schematic front view of a second embodiment;

FIG. 7 is a schematic plan view of a modified embodiment; and

FIG. 8 is a schematic plan view of a third embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS [Embodiment 1]

FIGS. 1 to 5 illustrate an embodiment of the present invention, andparticularly illustrate the whole structure when the present inventionis adapted to a wire bonder of the single independent type.

As shown in the drawings, a wire bonder 1 has an XY table 4 that isarranged on the upper rear portion of a frame 2 and that is driven by amotor 3 or the like. A bonding head 5 of a light weight is mounted onthe XY table 4. Though not diagramed, the bonding head 5 is equippedwith a cam mechanism to swing a bonding arm 6 which protrudes in frontof the bonding head 5 up and down, so that a bonding tool (capillary) 7attached to the end of the arm 6 is moved up and down. Further, aclamper 8 and a wire guide 9 protruded from the bonding head 5 atpositions over the bonding arm 6. At an upper position, furthermore,there is provided a spool 10 on which is wound a very fine wire 11 foreffecting the wire bonding onto the works (semiconductor members) thatwill be mentioned later. The wire 11 passes through between the wireguide 9 and the clamper 8, and the end thereof is inserted in thebonding tool 7. The clamper 8 is also actuated by the cam mechanism.Above the bonding head 5, there is arranged a TV camera 13 equipped withan optical system 12 which is an imaging device for work positiondetector means which detects pellet position on a lead frame and a leadposition of the lead frame to effect the wire bonding automatically. TheTV camera takes an image on an enlarged scale of a work moved onto abonding stage 17 that will be described later, detects a pellet positionor a lead position or both by a recognizing device that is not shown, sothat the bonding position can be controlled. In addition to the TVcamera 13, a microscope 15 is also arranged so that the operator isallowed to observe the work on an enlarged scale.

In front of the bonding head 5, furthermore, there is provided a stageframe 16 on the frame 2 to constitute the bonding stage 17. On the stageframe 16, there is provided a frame chute 18 consisting of a pair ofchutes that are arranged in parallel in the back and forth direction andthat stretch in the right and left direction. Adjacent to the framechute 18, furthermore, there is provided a frame feeder 19 which servesas work moving means, which moves the works sent onto the frame chute 18by the action of the frame feeder 19 from the left toward the right inFIG. 1, and which stops them just under the bonding tool 7, so that thewire bonding is effected for the works. A heat block 20 is arrangedunder the frame chute 18 to heat the work that is moved on the framechute 18 and stopped. A case 21 holding the works are set to the leftside of the bonding stage 17, a loader 22 is provided to take out theworks one by one and to send them to the frame chute 18, an empty case23 is set to the right side, and an unloader 24 is provided to put intothe case the works which are conveyed to the right end of the framechute 18 and to which the wire has been bonded. In FIGS. 1 to 3,reference numeral 25 denotes various units holding electric circuitparts, 26 denotes an ultrasonic wave oscillator provided as required, 27denotes an operation panel, and 28 denotes a manipulator.

Construction of the bonding stage 17 is shown in FIGS. 4 and 5. A pairof chutes 30, 30 constituting the frame chute 18 that serves as chutemoving means are made of rail members each having a U-shaped crosssection. The chutes have grooves 30a, 30a that are opposed to eachother, and are arranged maintaining a suitable distance, so that bothsides of a work represented by a lead frame X are just fitted into thegrooves 30a, 30a. In this embodiment, the chutes 30, 30 are providedwith brackets 31, 31 as a unitary structure. Screws 34, 34 rotated bymotors 32, 32 or gear mechanisms 33, 33 are screwed into the brackets31, 31 in the direction of width of the chutes 30, 30 (in a direction atright angles with the direction of length). The motor 32, 32, gearmechanisms 33, 33, and screws 34, 34 constitute a chute adjustingportion 35. By driving the motors 32, 32, the screws 34, 34 are rotatedvia gear mechanisms 33, 33, and the chutes 30, 30 are independentlymoved in small amounts in the direction of width, to that positions inthe direction of width are finely adjusted.

The frame feeder 19 has pinch rollers 36, 36 that are arranged atseveral places (two places in this embodiment) in the lengthwisedirection of the frame chute 18. Each of the pinch rollers 36, 36consists of rollers 39, 39 made of, for example, a resin attached to theupper and lower drive shafts 37, 37 and freely rotating shafts 38, 38that stretch in the direction of width of chute 18. A work X isresiliently held from the upper and lower directions by the rollers 39,39 by the force of springs 40, 40 urged to the freely rotating shafts38, 38. The drive shafts 37, 37 are equipped with motors 41, 41,rotational angle detector mechanism that are not shown, and gearmechanisms 42, 42, thereby to constitute a roller drive portion 43. Bydriving the motors 41, 41, the drive shafts 37, 37 and rollers 39, 39are rotated in the forward direction or in the reverse direction viagear mechanisms 42, 42, and the work X is moved along the frame chute18. Here, the motors 41, 41 are rotated by a desired angle, whereby therollers 39, 39 are turned, and the pinch rollers 19, 19 feed the work Xby a predetermined amount.

The heat block 20 consists of a plurality of (four in this embodiment)blocks 46a to 46d that are divided in the lengthwise direction viaheat-insulating walls 47a to 47c, and that are placed on a support block45 supported at the upper end of an up-down moving shaft 44 as shown inFIG. 4. The blocks 46a to 46d contain heaters 48a to 48d and temperaturesensors 49a to 49d, the pairs of heaters 48a to 48d and temperaturesensors 49a to 49d being connected to temperature control portions 50ato 50d and being further connected to a temperature distribution controlportion 51. Here, relying upon the heaters 48a to 48d and thetemperature sensors 49a to 49d, temperatures of the blocks 46a to 46dare feedback-controlled by the temperature control portions 50a to 50d.The temperature distribution control portion 51 controls the temperaturecontrol portions 50a to 50d to maintain preset temperatures. The heatblock 20 is brought into contact with the lower surface of work X on theframe chute 18 to heat the work X at a temperature suited for effectingwire bonding.

In addition to being constructed as mentioned above, the chute adjustingportion 35, the roller drive portion 43, and the temperaturedistribution control portion 51 are connected to a central controlportion 52 as shown in FIG. 1, so that each of the portions iscontrolled by the central control portion 52. Cam mechanisms of thebonding head 5 and drive system of the XY table 4 may be related to thecentral control portion 52, as a matter of course. The central controlportion 52 introduces signals S₁ from the TV camera 13 and kind-of-worksignals S₂ from the loader 22, and an operation circuit containedtherein calculates an optimum bonding portion of the work and thetemperature (inclusive of temperature distribution) thereof. The centralcontrol portion 52 is, usually, comprised of a microcomputer, and storesa variety of data.

Function of the thus constructed wire bonder will be described below.

A work or workpiece (a lead frame to which an element pellet is attachedin this emboidment) which is taken out from the case 21 and is set tothe loader 22, is moved by a loader mechanism (not shown) onto the framechute 18 with its both sides being guided by the grooves 30a, 30a of thechutes 30, 30. In this case, data related to the kind of work X andother data are sent as signals S₂ to the central control portion 52. Theadjusting signal of the control portion 52 is sent to the chuteadjusting portion 35 so that one or both of the chutes 30, 30 are movedby small amounts in the direction of width, and that the chutes 30, 30will finally hold both sides of the work X maintaining a gap whichpermits the work X to move. This enables the position of the work X tobe determined in the direction of width.

The work X moved onto the frame chute 18 is held at its upper and lowersurfaces by the pinch roller 19 which is rotated by the roller driveportion 43, and is moved on the frame chute 18 in the lengthwisedirection. At a moment when the work X constituted in the form of aseries of lead frames is moved near to the first bonding position, theTV camera 13 detects the work X, and the central control portion 52causes the pinch roller 19 to stop the moving operation. Namely, animage of the surface of work X is obtained, and the pattern (padposition) of the element pellet, shape of the lead, and external shapeof the work, are sent as signals S₁ to the central control portion 52which finds an optimum position of the work X, present position, anddisplacement thereof relying upon the above-mentioned signals S₂ and thesignals S₁, and which produces an adjusting signal based thereupon tothe roller drive portion 43, so that the pinch rollers are turned by arequired angle. The pinch roller 19 is turned in the forward or reversedirection to move the work X in small amounts, thereby to determine theposition of the work X in the lengthwise direction. To increase thepositioning precision while the work is being moved, the heating blockand the pressing plate are retracted to positions where they will notcome into contact with the work. Further, the data related totemperature is sent from the central control portion 52 to thetemperature distribution control portion 51 simultaneously therewith orin advance. Based upon the material, shape, size and the like of thework, the temperature distribution control portion 51 calculates thetemperature distribution (gradient) of the whole heat block 20 so thatan optimum heating can be effected, and sends setpoint temperaturesignals to the temperature control portions 50a to 50d. Therefore, theindividual temperature control portions 50a to 50d set the temperaturesfor the blocks 46a to 46d relying upon feedback control, in order tosuitably heat the work X. The bonding tool 7 effects the wire bonding ina customary manner, and its operation is not described here.

When the first bonding is finished, the central control portion 52 sendsa signal to the roller drive portion 43 based upon the data related topitch of the work X, and the pinch roller 19 moves the work X by anamount equal to the pitch. Here, the pinch roller 19 is turned by smallamounts to precisely set the position of work in the same manner asdescribed above. The frame chute 18 needs no adjustment, but may beadjusted as required. Further, the temperature distribution of the heatblock 20 may often be suitably adjusted accompanying the movement of thework X.

After the bonding is finished, the work X is moved rightwardly by thepinch roller 19 and is introduced into the case 23 from the frame chute18 by an unloader mechanism (not shown) of the unloader 24 at theextreme end of the frame chute 18. Thus, a series of steps arecompleted. A next work X will have been supplied onto the frame chute18. When the work X is of the same kind as the previous one, the wirebonding is effected nearly under the same conditions. When the work X isof a different kind, the aforementioned operation is performed again, inorder to accomplish the optimum wire bonding.

Here, instead of finely adjusting the position of work X, the pinchroller 19 may roughly set the position of the work X in accordance withthe pitch of the work X. Then, deviation from a reference position ofwork X is detected by the TV camera 13, and then the bonding tool(bonding head 5 and XY table 4) is controlled to effect wire bonding. Inthis case, however, it becomes difficult to control the temperature veryprecisely with the heat block 20.

According to this embodiment, therefore, there is no need of exchangingthe frame feeder unit even when work of different kinds is to besubjected to wire bonding. Therefore, wires can be bonded to variouskinds of work automatically maintaining high precision and high qualitywithout interrupting wire bonding. In other words, there is provided ageneral-purpose wire bonder.

[Embodiment 2]

FIG. 6 is a diagram showing the whole structure of an embodiment inwhich the present invention is adapted to a wire bonder 60 of thecontinuous processing type.

In FIG. 6, the wire bonder 60 is arranged at a position on thedownstream side of a pellet bonder 61 (baking furnace and buffer arearranged between the wire bonder 60 and the pellet bonder 61). Anelement pellet is attached onto the work X, i.e., onto the lead frame,by the pellet bonder 61. The work X is then moved into the wire bonder60 where wire bonding is effected.

Like the above-mentioned embodiment, the wire bonder 60 has a bondinghead 63 with a bonding tool 62, and has a bonding stage 64 which isprovided with a frame chute 66 that works as a frame feeder 65, and apinch roller 67. Further, the bonding head 63 is equipped with a TVcamera 68 for imaging the work X.

The wire bonder 60, however, is not provided with a loader or anunloader but, instead, is provided with a pre-stage 69 at a positionjust on the upstream side thereof. The pre-stage 69 is provided with aconveyer 73 which consists, for example, of motor 70, pulleys 71, belt72, and the like. The work X sent from the pellet bonder 61 is movedfrom the left toward the right in the drawing, and is finally moved intothe frame chute 66 via a conveyer that is not shown. A TV camera 74 isdisposed over the pre-stage 69 to take the image of work X on theconveyer 73. The TV camera 74 is connected to the central controlportion (same as the aforementioned portion 25) 75 together with the TVcamera 68 of the wire bonder 60 to send image data signals of the workthereto. The central control portion 75 controls the chute adjustingportion 66A, roller drive portion 67A, and temperature distributioncontrol portion 77 for the heat block 76 in the bonding stage 64.

As the work X to which the pellet has been bonded is moved onto thepre-stage 69, the conveyer 73 operates to move the work X. The conveyer73 is stopped temporarily when the work X is brought to nearly a centralposition, and the work X is imaged by the TV camera 74. The imaged dataare sent to the central control portion 75 where the kind, shape, andsize of the work X are verified and stored, and where an optimum wirebonding position of the work X is calculated with the pre-stage 69 as areference, and is converted into data for the bonding stage 64.

Then, the conveyer 73 operates again to move the work X to the right endwhere it is moved onto the frame chute 66 on the bonding stage 64 by aconveyer that is not shown. Since the chute adjusting portion 66A,roller drive portion 67A and temperature distribution control portion 77have already been controlled by the data from the pre-stage 69, thebonding stage 64 is allowed to quickly place the work X under optimumbonding conditions in combination with imaged data from the TV camera68. Functions of the frame chute 66, pinch roller 67 and heat block 76based upon the chute adjusting portion 66A, roller drive portion 67A andtemperature distribution control portion 77, are roughly the same asthose of the aforementioned embodiment. This makes it possible to effectoptimum wire bonding quickly and automatically for the works of avariety of kinds.

In order to increase the efficiency of wire bonding, a plurality of(three in this case) wire bonders 80 may be arranged in parallel asshown in FIG. 7. Each of the wire bonders 80 have a frame-supplyconveyer 81, a frame-discharge conveyer 82, a loader-side frame-movingconveyer 83, a loading conveyer 84, an unloading conveyer 85, and anunloader-side frame-moving conveyer 86, that move in the directionsindicated by arrows. In particular, the unloader-side frame-movingconveyer 86 is capable of reciprocally moving in the directionsindicated by a double-line arrow.

Therefore, the works X conveyed onto a pre-stage 87 at the furthestupstream position of the wire bonders 80 are successively movedrightwards by the frame-supply conveyer 81, scooped successively by theloader-side frame-moving conveyer 83 of each of the wire bonders 80, andare moved onto the frame chute 89 of the bonding stage 88. Thewirebonded work X is moved from the unloading conveyer 85 onto theunloader-side frame-moving conveyer 86, and is further moved into acontainer portion 93 on the right side by the frame-discharge conveyer82. In the drawing, reference numeral 94 denotes a bonding head, and 95denotes a bonding tool.

The wire bonders 80 operate in parallel. Therefore, there is no waitingtime for the work X, and bonding is carried out efficiently. Each wirebonder 80 is served with the data of work and control signals thereforsent from the TV camera 90 of the pre-stage 87 and from the centralcontrol portion 91. Based upon these data and signals, each bondingstage 88 controls the frame chute, pinch roller and heat block, whichare not shown, and sets optimum bonding conditions in cooperation withits own TV camera 92.

Here, the loader-side frame-moving conveyer 83, loading conveyer 84, andunloading conveyer 85 can be removed and, instead, the loader case andunloader case can be mounted in each of the wire bonder 80, in order touse it as a single independent machine like in the aforementioned firstembodiment.

[Embodiment 3]

FIG. 8 is a plan view showing the structure of an embodiment in whichthe present invention is adapted to a pellet bonder. A pellet bonder 100has a bonding head 102 and a bonding stage 103 mounted on a frame 101.The bonding head 102 has a collet 104 attached to the tip of a bondingarm 105, the collet 104 serving as a bonding tool which holds an elementpellet Y and adheres it onto the work X such as lead frame. On thebonding head 102 is mounted a TV camera 106 directed to the stage 103.

On the bonding stage 103 are arranged a frame chute 107, a pinch roller108, and a heat block 109 nearly in the same manner as the firstembodiment. The work X guided by the frame chute 107 is moved by thepinch roller 108 rightwardly in the drawing, stopped at the bondingposition, and is heated by the heat block 109. An intermediate pelletreceiving portion 110 is disposed on a portion of the stage 103, and theelement pellet Y to be bonded is conveyed by a supply system 111 from awafer position which is not shown to the intermediate pellet receivingportion 110. The collet 104 adsorbs the pellet Y on the intermediatereceiving portion 110, carries it onto the work at the bonding position,and adheres it thereto.

A work supply portion 112 is disposed on the upstream side of the pelletbonder 100. The work supply portion 112 has a case feeder 114 whichholds in parallel a plurality of cases 113 that contain works ofdissimilar kinds. The case feeder 114 is moved in a direction in whichthe cases are arranged in parallel by drive means 115 such as beltmechanism or the like. A loader 116 is provided under the feeder 114 torightwardly move in the drawing a case 113 on the feeder 114 thatstopped on the loader 116. A take-out mechanism 117 such as lifter orpusher is provided on the right side of the loader 116 to take out thework X from the case 113 onto a neighboring pre-chute 118 which isinterlocked with the frame chute 107 of the pellet bonder 100 and whichhas a TV camera 119 installed thereon. The TV camera 119 is connected tothe central control portion 120 together with the TV camera 106, and isfurther connected to each of the portions of the bonding stage 103.Further, the drive means 112 of the case feeder 114 is driven by afeeder control portion 121 which receives a kind-of-pellet signal fromthe pellet supply portion 111.

According to the above-mentioned construction, the kind-of-pellet signalis input to the feeder control portion 121 just when the pellet issupplied from the pellet supply portion 111 to the intermediatereceiving portion 110. Then, the feeder control portion 121 selects awork that is adapted to the pellet, and the drive means 115 operates thecase feeder 114, so that a required case 113 is moved onto the loader116. Then, the loader 116 takes the case 113 out of the feeder 114, andthe work X in the case 113 is moved onto the pre-chute 118 by thetake-out mechanism 117.

In the pre-chute 118, the TV camera 119 obtains the image of work X,sends signals to the central control portion 120, so that the kind ofwork and adaptability are confirmed relying upon the sharp, size and thelike of the work X. Here, relative positions of tabs of the work X canbe introduced as data. The work X is moved onto the frame chute 107 ofthe pellet bonder 100, and is then moved and is placed in position bythe pinch roller 108. At this moment, signals are sent from the centralcontrol portion 120 to the chute adjusting portion, roller drive portionand temperature distribution control portion (which are not shown), sothat the chute 107, pinch roller 108 and heat block 109 are controlledto place the work X under optimum bonding conditions.

Here, if a constant or a predetermined relation is maintained withregard to relative positions between the pre-chute 118 and the framechute 107, either one of the TV camera 106 or 119 can be eliminated.Further, either one of them can be replaced by another detector such asposition sensor or the like.

According to this embodiment, there is no need for exchanging the casecontaining work or exchanging the frame feeder unit of the bonding stagefor each change in the kind of work, in performing the process forbonding pellets onto semiconductor devices of dissimilar kinds.Therefore, pellets of various kinds can be bonded automatically andcontinuously maintaining high precision.

The present invention exhibits effects that are described below.

(1) Provision is made for moving means which continuously move the work,detector means which detecting portions of the work, and control meanswhich find the present position of the work depending upon the datarelated to the kind of work and signals of the detector means, and whichcontrol the moving means based upon the present position of the work inorder to set a portion of the work to be bonded to the bonding position.Therefore, even when work of different kinds is to be treated, there isno need to exchange the unit such as frame feeder. Works of variouskinds can be set at an optimum bonding position, making it possible tocarry out the operation fully automatically and to meet generalpurposes.

(2) Since use is made of the pinch roller as a moving means that holdsthe work and that is turned in a forward or reverse, direction theposition can be set while moving the work in small amounts in theforward and reverse directions; i.e., the position of the work can beset highly precisely.

(3) A detector for detecting the bonding position can also be utilizedas detector means.

(4) A TV camera is used as detector means which is provided on apre-stage on the upstream side. Therefore, the kind of work, shape andsize can be detected in advance, and the bonding position can be setquickly.

(5) Provision is made of second moving means for moving the frame chutein the direction of width responsive to the width of the work, inaddition to moving means which moves the work in the lengthwisedirection. Therefore, the position can be set not only in the lengthwisedirection of the work but also in the direction of width. In particular,positions of work having different widths can be set maintaining highprecision.

(6) The heat block provided on the bonding stage is divided in thedirection of length, and temperatures of the individual blocks areindependently controlled. Therefore, any desired temperaturedistribution can be selected to heat the work.

(7) Provision is made for detector means to detect the work on theupstream side of the bonder, moving means installed on the bonding stageto continuously move the work, and control means which controls themoving means based upon a work detect signal from the detector means andwhich sets the work to the bonding position. Therefore, even when workof different kinds is to be treated, there is no need to change the unitsuch as frame feeder. Work of various kinds can be set at an optimumbonding position, making it possible to carry out the operation fullyautomatically and to meet general purposes.

(8) A pre-stage is provided on the upstream side of the bonder, a TVcamera is provided as detector means on the pre-stage to detect theshape, size, bonding position and the like of the work, and the positionof the work is set by control means based upon a relation of relativepositions between the pre-stage and the bonding position. Therefore, theoperation can be effected quickly.

(9) A work supply portion is provided at a position on the upstream sideof the bonder to supply work of various kinds, and necessary work isautomatically supplied to the bonder. Therefore, the operation can becarried out fully automatically.

(10) In the work supply portion, cases containing work of various kindsare arranged on the feeder, and the positions of the cases are changedin the direction in which they are arranged. Therefore, the constructioncan be quite simplified and the work can be taken out correctly.

(11) When the apparatus is constructed to work as a pellet bonder, thework corresponding to an element chip can be automatically supplied bythe work supply portion, and the element chip can be correctly adheredto a predetermined portion of the work, making it possible toautomatically assemble the semiconductor devices.

In the foregoing the invention as described by way of specificembodiments. The invention, however, should in no way be limited to theabove embodiments only, but can be modified variously without departingfrom the spirit and scope of the invention.

For instance, drive mechanisms such as the pinch roller that constitutesmoving means and chutes that constitute second moving means, can besuitably changed. Instead of TV cameras, furthermore, detector means maybe those that work optically. In the aforementioned embodiments,furthermore, the wire bonder may be replaced by the pellet bonder, andthe pellet bonder may be replaced by the wire bonder. Moreover, theembodiments may be combined.

The foregoing description has chiefly dealt with the case where theinvention accomplished by the inventors was adapted to the bondingtechnique for the semiconductor devices of the lead frame type in thefield of art that served as the background of the invention. Theinvention, however, is in no way limited thereto only, but can also beadapted to the apparatus for processing or manufacturing semiconductordevices that use ceramics or other package bases and works other thanthe semiconductor devices.

What is claimed is:
 1. A manufacturing method for a semiconductor devicewhich includes a semiconductor pellet, a plurality of metal leads, and aplurality of bonding wires connecting therebetween, comprising the stepsof:detecting the type of lead frame being processed; generating an ouputsignal indicative of the type of the lead frame detected; controlling atleast one bonding condition in response to the output signal so as toobtain an appropriate bonding between the pellet and the lead portionsof the lead frame being processed irrespective of the type of lead framebeing processed; and performing wire bonding processes according to thecontrolled bonding condition.
 2. A manufacturing method for enablingprocessing of a plurality of different types of lead frames to insureappropriate bonding of at least one electrical component to a lead framebeing processed, comprising the steps of:providing an ouput signalindicative of the type of lead frame being processed; and controlling atleast one bonding condition of the at least one electrical component andthe lead frame in dependence upon the type of lead frame being processedin accordance with the output signal indicative of the type of leadframe being processed; whereby an appropriate bonding of the at leastone electrical component to the lead frame being processed is obtainedirrespective of the type of lead frame being processed.
 3. Amanufacturing method according to claim 2, wherein the output signalindicative of the type of lead frame being processed is provided by adetecting means of a lead frame indicating means, the detecting meansdetecting the type of lead frame being processed and providing theoutput signal indicative thereof.
 4. A manufacturing method according toclaim 3, wherein the at least one electrical component includes asemiconductor device pellet, and further comprising the step of securingthe semiconductor device pellet on a predetermined bonding position ofthe lead frame being processed by a pellet bonding apparatus.
 5. Amanufacturing method according to claim 3, further comprising the stepsof transferring the lead frame to a predetermined bonding position witha transfer means, the transfer means being variable in a lengthwisedirection of the lead frame for varying the lengthwise transfer positionthereof, and controlling the transfer means with a control means to varythe lengthwise transfer position of the lead frame in accordance withthe detected type of lead frame being processed at the at least onebonding condition.
 6. A manufacturing method according to claim 4,further comprising the steps of guiding the lead frame to apredetermined bonding position with a guide means, the guide means beingvariable in a widthwise direction of the lead frame to vary thewidthwise guiding of the lead frame, and controlling the guide meanswith a control means to vary the widthwise guiding of the lead frame inaccordance with the detected type of lead frame being processed as theat least one bonding condition.
 7. A manufacturing method according toclaim 4, further comprising the steps of heating the lead frame with aheat block means at the predetermined bonding position, and controllingthe temperature of the heat block means with a control means inaccordance with the detected type of lead frame being processed as theat least one bonding condition.
 8. A manufacturing method according toclaim 7, wherein the heat block means comprises a plurality ofindividual sections, and the control means controls the temperature ofthe individual sections of the heat block means so as to control atemperature distribution of the heat block means condition in accordancewith the detected type of lead frame being processed as the at least onebonding condition.
 9. A manufacturing method according to claim 3,wherein the at least one electrical component includes fine wires, andfurther comprising the steps of effecting a wire bonding process forconnecting the fine wires between bonding pads on a semiconductor devicepellet and leads of the lead frame being processed at a predeterminedwire bonding position.
 10. A manufacturing method according to claim 9,further comprising the steps of transferring the lead frame with atransfer means to the predetermined bonding position, the transfer meansbeing variable in a lengthwise direction of the lead frame for varyingthe lengthwise transfer position thereof, and controlling the transfermeans with a control means to vary the lengthwise transfer position ofthe lead frame in accordance with the detected type of lead frame beingprocessed as the at least one bonding condition.
 11. A manufacturingmethod according to claim 9, further comprising the steps of guiding thelead frame to the predetermined bonding position with a guide means, theguide means being variable in a widthwise direction of the lead frame tovary the widthwise guiding of the lead frame, and controlling the guidemeans with the control means to vary the widthwise guiding of the leadframe in accordance with the detected type of lead frame being processedas the at least one bonding condition.
 12. A manufacturing methodaccording to claim 9, further comprising the steps of heating the leadframe with a heat block means at the predetermined bonding position, andcontrolling the temperature of the heat block means with a control meansin accordance with the detected type of lead frame being processed asthe at least one bonding condition.
 13. A manufacturing method accordingto claim 12, wherein the heat block means comprises a plurality ofindividual sections, and the control means controls the temperature ofthe individual sections of the heat block means so as to control atemperature distribution of the heat block means in accordance with thedetected type of lead frame being processed as the at least one bondingcondition.
 14. A manufacturing method for a semiconductor device whichincludes a semiconductor pellet, a plurality of metal leads, and aplurality of bonding wires connecting therebetween, comprising the stepsof:detecting the type of lead frame being processed; providing an outputsignal indicative of the type of the lead frame detected; and securingthe semiconductor pellet on the lead frame by automatically setting adie-bonding condition in accordance with the output signal so as toobtain an appropriate bonding to the semiconductor pellet and the leadsof the lead frame.
 15. A manufacturing method according to claim 14,wherein the step of detecting the type of lead frame includes utilizinga TV camera.
 16. A manufacturing method according to claim 14, whereinthe automatic setting of the die-bonding condition includesautomatically setting chute means for guiding a transferred lead frameto be processed in accordance with the output signal, and transferringthe lead frame to be die-bonded.
 17. A manufacturing method according toclaim 14, wherein the automatic setting of the die-bonding conditionincludes automatically setting a transferring pitch for the lead framein accordance with the output signal, and transferring the lead frame toa position to be die-bonded.
 18. A manufacturing method according toclaim 14, further comprising the step of controlling a temperaturedistribution of heat block means for heating the lead frame when thelead frame is being die-bonded.
 19. A manufacturing method according toclaim 15, wherein the automatic setting of a die-bonding conditionincludes automatically setting chute means for guiding a transferredlead frame to be processed in accordance with the output signal, andtransferring the lead frame to be die-bonded.
 20. A manufacturing methodaccording to claim 15, wherein the automatic setting of the die-bondingcondition includes automatically setting a transferring pitch for thelead frame in accordance with the output signal, and transferring thelead frame to a position to be die-bonded.
 21. A manufacturing methodaccording to claim 15, further comprising the step of controlling atemperature distribution of a heat block means for heating the leadframe when the lead frame is being die-bonded.